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High frequency pulsed laser SLS method for production of highly uniform polysilicon thin films

Summary

High performance thin film transistors (TFTs) require the production of highly uniform films of polysilicon (polycrystalline silicon). Sequential lateral solidification (SLS) is one technique for producing polycrystalline films, which uses controlled laser pulses to melt a region of amorphous or polycrystalline thin film on a substrate. Substrates fabricated by SLS are limited by the microstructure of the polycrystalline thin film. This technology improves the uniformity of the crystalline structure produced by SLS, by aligning the beamlets of an excimer laser and overlapping sequential passes to reduce the amount of edge area in the grain structure, where non-uniformities tend to occur. Using this SLS method for processing thin films provides the potential for efficient, improved thin film device fabrication on a number of substrates, including those intolerable to heat.

Technology Benefits

Improves uniformity of polysilicon thin films produced using Sequential Lateral Solidification (SLS)Patent Information:Patent (US 13/892,904) Tech Ventures Reference: IR M06-011

Technology Application

Production of high performance active matrix LCD and OLED displaysProduction of high efficiency polysilicon solar cellsFabrication of 3D integrated circuits

Detailed Technology Description

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*Abstract

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*Inquiry

Greg MaskelColumbia Technology VenturesTel: (212) 854-8444Email: TechTransfer@columbia.edu

*IR

m06-011

*Principal Investigator

Country/Region

USA