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Decreasing surface roughness of thin film semiconductors using laser processing

Summary: James Im, Ph.D..

Technology Benefits: Improves performance of crystallized thin film semiconductorsImplementable as both a processing and post-processing stepCompatible with multiple different crystallization techniques, such as sequential lateral solidificationVarious beam shapes can be usedPatent information:Patent Issued (US 7220660)Tech Ventures Reference: IR MS99/04/26E

Technology Application: Thin film transistor (TFT) manufactureSemiconductor processingFabrication of flat panel displays

Detailed Technology Description: James Im, Ph.D..

*Abstract: None

*Inquiry: Jim AloiseColumbia Technology VenturesTel: (212) 854-8444Email: TechTransfer@columbia.edu

*IR: MS99/04/26E

*Principal Investigator

Country/Region: USA

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