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LED封裝結構和LED發光裝置

Summary: 本發明提供了LED封裝結構和LED發光裝置，其中，LED封裝結構包括LED芯片和覆蓋LED芯片的波長轉換物質層，波長轉換物質層的紅色螢光粉的量在LED芯片的邊緣位置處低於中心位置處。

Technology Benefits: 通過減少LED芯片邊緣位置的紅色螢光粉，實現在LED芯片的邊緣位置避免直接或者間接方式激發產生紅光，向高色溫方向調節邊緣位置處的色溫，減輕了黃暈的問題。

Technology Application: Lighting

Application Date: 2016-03-30

Application No.: CN201610190008.8

Classes: H01L33/50 | H01L33/48

Coverage Areas: 封装模组

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