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一種LED封裝體 | LED packaging body
Summary
本實用新型涉及一種LED封裝體，包括：基板、LED芯片、封裝膠、至少一個透光柱，LED芯片封裝在基板上形成LED光源，封裝膠覆蓋在LED光源表面，透光柱設置在封裝膠的表面，透光柱是納米二氧化硅硅膠的透光柱；LED光源發出的光經封裝膠後射入透光柱內，並通過透光柱內的二氧化硅顆粒散射均勻出光。
Technology Benefits
發光角度大、出光均勻、出光效率高、易操作
Technology Application
Lighting
Application Date
2015-12-21
Application No.
CN201521074032.2
Classes
H01L33/58 | H01L33/56 | H01L33/48
Coverage Areas
封装模组
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