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一種使用導電黏合劑黏接電氣設備的方法及系統

Summary

A method for bonding electric devices (13, 15) of the system (10), the use of conductive adhesive (14) the electrical device (13, 15) adhered together. The system (10) comprising: an ultrasonic vibration generating ultrasonic transducer (11) and operatively connected to and covering the ultrasonic transducer (11) of the operating end (12) of the ultrasonic - thermal means (20), said ultrasonic - thermal means (20) so that the damping of the ultrasonic vibration transmitted to the first electric devices (13) ultrasonic vibration minimum, and to the ultrasonic vibration is converted to heat pulse, the heat pulse by said first electric equipment (13) to said conductive adhesive (14), wherein said adhesive (14) is softened so that the heat pulse to said electrical device (13, 15) bonded together.

Industry

Electronics

Sub Group

Semiconductor

Others

Country/Region

Mainland China

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