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Integrated Electronic Microphone Having a Perforated Rigid Back Plate Membrane

Summary
Miniaturized microphones are used in a wide range of applications, such as cell phones, hearing aids, smart toys and surveillance devices. It would be desirable to design such microphones and manufacturing methods therefore that allow batch production and allow the integration of the microphone with miniaturized devices having other functions. Microfabrication of various types of miniature microphones has been explored.

In the present invention, a device is proposed consisting of one or more microphones with micro-meter to milli-meter sized acoustic excitation pressure sensing membranes integrated with signal sensing and amplifying electronic elements. Acoustic excitation is converted to an electrical signal using a capacitor with an air-gap formed between a sensing membrane(sensing electrode) and a perforated rigid back-plate membrane(counter electrode). The capacitor can self-bias using charges permanently injected into an electrically floating electrode embedded inside one of the membranes. Alternatively, the capacitor can be biased externally. A process is now proposed to allow simultaneous realization of the mechanical component for acoustic pressure sensing and the electronic components for electrical signal processing is also proposed.
Technology Benefits
1. Simultaneous realization of both the mechanical and electronic components of an "integrated" microphone using micro-fabrication process
2. Enhance device performance and reliability so that number of sub-components can be reduced
3. Simple process
4. High electronic programmability
5. High ease of integration
Technology Application
- Mobile phones, hearing aids, surveillance, toys, etc.
Supplementary Information
Patent Number: US7642575B2
Application Number: US2006647382A
Inventor: Wong, Man | Zohar, Yitshak
Priority Date: 18 Jan 2002
Priority Number: US7642575B2
Application Date: 29 Dec 2006
Publication Date: 5 Jan 2010
IPC Current: H01L002720 | H01L002984 | H04R001900 | H04R001904
US Class: 257254 | 257416 | 381174
Assignee Applicant: The Hong Kong University of Science & Technology
Title: Integrated electronic microphone having a perforated rigid back plate membrane
Usefulness: Integrated electronic microphone having a perforated rigid back plate membrane
Summary: For applications, e.g. cell phones.
Novelty: Semiconductor device, e.g. for cell phones, has microphone formed in integrated manner and comprising sensing electrode formed as part of acoustic pressure sensing membrane and connected to gate of sensing transistor, and counter electrode
Industry
Electronics
Sub Category
3C/Gadgets
Application Date
29 Dec 2006
Application No.
US 11/647382
Patent Information
US 7642575
ID No.
TTC.PA.162
Country/Region
Hong Kong

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