A package substrate includes: an insulating substrate, a first and a second soldering pads spacedly disposed on a first surface of the insulating substrate, a first and a second electrodes spacedly disposed on an opposite second surface of the insulting substrate. The first and the second soldering .....
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The present invention provides an apparatus and method for controlling power and clock speed of an electronic system. The present invention detects a voltage signal and a current signal as the electronic system is operating, and obtains a power value. The present invention decides whether the power .....
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The present invention provides a cursor control method for adjusting a smoothness of a cursor motion shown on an image display according to a trace variation detected by a detection device.
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