The present disclosure provides a LED package structure and a LED light-emitting device. The LED package structure comprises a LED chip and a wavelength converting layer covering the LED chip. The wavelength converting layer contains red phosphor, which has lower amount in edge portion than in cente.....
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A method for fabricating micromachined structures is provided. At least one cavity is formed on a substrate and then a dielectric material different from the material of the substrate is filled in the at least one cavity. Next, a circuitry layer including a first etch-resistant layer and a dielectri.....
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A direct-lit type backlight source includes a backplate and a point light source array disposed on the backplate. A light output shape of a first optical lens employed by each of point light sources of corner regions of the point light source array and that of a second optical lens employed by each .....
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