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Composition for photoimaging

Summary

An improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of a difunctional epoxy resin. The photosensitive cationically polymerizable epoxy based system is especially useful as a solder mask and does not contain bromine.

Technology Benefits

Photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns.

Type of Cooperation

This patent is made available for free use by all, except when another provider attempts to enforce a patent in an EPC class against the provider or when a non-provider attempts to enforce any patent against the provider.

Coverage Areas

Other

Goods and Services

Waste management > Pollution control

ID No.

US6576382

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