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Real-Time S-Parameter Imager


Summary

Disclosed Is A Fully Automated System Capable Of Producing High Quality Real-Time S-Parameter Images. It Is A Useful And Versatile Tool In Material Science And Solid State Technology For Determining The Location Of Subsurface Defect Types And Concentrations On Bulk-Materials As Well As Thin-Films. The System Is Also Useful In Locating Top Surface Metallizations And Structures In Solid State Devices. This Imaging System Operates By Scanning The Sample Surface With Either A Small Positron Source (22Na) Or A Focused Positron Beam. The System Also Possesses Another Two Major Parts, Namely Electronic Instrumentation And Stand-Alone Imaging Software. In The System, The Processing Time And Use Of System Resources Are Constantly Monitored And Optimized For Producing High Resolution S-Parameter Image Of The Sample In Real Time With A General Purpose Personal Computer.; The System Software Possesses Special Features With Its Embedded Specialized Algorithms And Techniques That Provide The User With Adequate Freedom For Analyzing Various Aspects Of The Image In Order To Obtain A Clear Inference Of The Defect Profile While At The Same Time Keeping Automatic Track On The Instrumentation And Hardware Settings. The System Is Useful For Semiconductor And Metal Samples, Giving Excellent Quality Images Of The Subsurface Defect Profile And Has Applications For Biological Samples.


Supplementary Information

Patent Number: US8053724B2
Application Number: US2010816218A
Inventor: Naik, Pranab Sabitru | Beling, Christopher David | Fung, Stevenson H. Y.
Priority Date: 14 Jul 2004
Priority Number: US8053724B2
Application Date: 15 Jun 2010
Publication Date: 8 Nov 2011
IPC Current: H01J0037256 | G01N002322
US Class: 250308 | 250307 | 250309 | 250310
Assignee Applicant: The University of Hong Kong
Title: Real-time S-parameter imager
Usefulness: Real-time S-parameter imager
Summary: Instrumentation setup for processing imager electronic signals in an imager apparatus (claimed) that is utilized for imaging a silicon wafer and gallium arsenide wafer.
Novelty: Instrumentation setup for processing imager electronic signals in imager apparatus that is utilized for imaging e.g. silicon wafer, has linear gates switched in response to transistor-transistor-logic high to produce coordinate signals


Industry

ICT/Telecom


Sub Group

Telecommunication


Application No.

US2007797621A


Country/Region

Hong Kong

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