Search
  • Within this site
AsiaIPEX is a one-stop-shop for players in the IP industry, facilitating IP trade and connection to the IP world. Whether you are a patent owner interested in selling your IP, or a manufacturer looking to buy technologies to upgrade your operation, you will find the portal a useful resource.
Back to search results

A Novel Signal Transduction Gene Confers Disease Resistance


Summary

A signal transduction related gene was cloned from the monocot plant rice. Expression of this gene in the dicot plant Arabidopsis thaliana enhances disease resistance and elevates expression of defense marker genes. The successful protection effect of a monocot gene in a dicot plant indicates its capability of broad spectrum resistance. No obvious negative effects of the transgene (such as program cell death) were exhibited by the transgenic plants. The invention can be applied to enhance broad spectrum disease resistance in corps.


Supplementary Information

Inventor: Lam, Hon-Ming | Sun, Samuel Sai Ming
Priority Number: US7994392B2
IPC Current: A01H000500 | C12N001509 | C12N001582
US Class: 800279 | 4350691 | 800278 | 800298 | 800317
Assignee Applicant: The Chinese University of Hong Kong
Title: Methods to enhance plant trauma resistance
Usefulness: Methods to enhance plant trauma resistance
Summary: The recombinant expression system is useful for conferring an enhanced ability to resist trauma on a plant, preparing a protein that has the amino acid sequence of OsGAP1 or its variants, and identifying a compound or combination of compounds that modulate the ability of plants to resist trauma (all claimed).
Novelty: New recombinant expression system comprises a nucleotide sequence encoding rice GTPase activating protein-1 (OsGAP1), useful for conferring an enhanced ability to resist trauma on a plant


Industry

Agriculture


Sub Group

Plant


Application No.

07/SCI/254


Others

Inventor(s): Professor Lam Hon Ming, Department of Biology

Patent Status:  US Patent Pending


Country/Region

Hong Kong

For more information, please click Here
Business of IP Asia Forum
Desktop View