METHOD FOR FABRICATING MICROMACHINED STRUCTURES
A method for fabricating micromachined structures is provided. At least one cavity is formed on a substrate and then a dielectric material different from the material of the substrate is filled in the at least one cavity. Next, a circuitry layer including a first etch-resistant layer and a dielectric layer is formed above the at least one cavity filled with the dielectric material. A portion of the circuitry layer exposed by the first etch-resistant layer is then etched. Finally, the dielectric material in the at least one cavity is etched out.
It is an object of the present invention to provide a novel method for fabricating micromachined structures that etches both the circuitry layer and the dielectric material in the cavities of the substrate in one etching process.
manufacturing
21-Nov-2007
11/944,247
MEMS
美國
