Self-Curved Diaphragms By Stress Engineering For Highly Responsive pMUT

- 95% wafer utilization- Foundry-based CMOS process- Frequency tuning to desired value- Both low frequency and high frequency pMUT arrays

- Ultrasonic gesture recognition- Range finding- Finger print identification- Medical imaging and diagnosis- Sensors in hand-held devices

None

WO2015112452

Additional Technologies by these Inventors

• Wafer Level Chip Scale Packaging Technology For Integrated Mems Devices
• Highly Responsive PMUT
• Cross Reactive FET Array for Gas Mixture Detection
• Shaped Piezoelectric Micromachined Ultrasonic Transducer Device
• Piezoelectric Micromachined Ultrasonic Transducer Device and Methods
• Advanced Chemical Sensing Method and Apparatus

Tech ID/UC Case

24472/2015-050-0

Related Cases

2015-050-0

美國

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