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Polymer-Based Heterogeneous Integration Technology
總結
Researchers at Purdue University have developed a new approach to remove the packaging and bulky passive elements from expensive active chips and fabricate them within a less expensive carrier substrate; therefore, reducing the cost of the integrated system.
技術優勢
Reduces size and costDecreases parasitic capacitance More reliable and efficient
技術應用
MaterialsManufacturingMicroelectronicsNanoelectronics
詳細技術說明
Saeed MohammadiPurdue Electrical and Computer Engineering
國家
United States
申請號碼
7,473,579
國家/地區
美國

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