Interfacial Convective Assembly for High Aspect Ratio Structures Without Surface Treatment
Value PropositionThe method:ΓÇóIs fast, effective, scalable and economical as compared to prior art techniquesΓÇóIs effective for assembly of nanoparticles on both hydrophobic and hydrophilic surfacesΓÇóEnables assembly of nanoparticles even on flexible and bendable substratesΓÇóEnables the prevention of evaporation and increased temperature as opposed to prior art proceduresΓÇóInvolves automatic convective flows due to liquid density differences, thereby avoiding use of other conventional requirementsΓÇóIs effectively used for assembling electronic and electrochemical systems such as nanowires, antennas, sensors, photonic devices, information storage medium, and display/optical and medical (e.g., drug release) devices on a commercial scale
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美國
