Nanoscale Interconnects Fabricated by Electrical Field Directed Assembly of Nanoelements
Value PropositionThe procedure:ΓÇóIs extremely cheap and cost effective, allowing effective performance at room temperature and pressure, as compared to some of prior art procedures requiring high or low temperatures/pressuresΓÇóEnables an effective reduction of grain boundaries, one of process limitations as observed with prior art procedures, thereby keeping a constant check at overall resistivity and electromigrationΓÇóIs effective in assembling both charged and uncharged particlesΓÇóIs further utilized with high aspect ratio as compared to conventional proceduresΓÇóAllows for production of nanoscale interconnects that are useful for variety of commercial applications such as in electronics, photonics, and biomedical device
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