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TRAY PACK AND PACKAGING STRUCTURE
總結
This technology enables constructing a simple packaging structure having few components and protecting a contained product against shock impacts coming from all directions. Proven record of commercial useFujitsu is using this technology internally to transport circuit board for some Networking Products to USA.
技術優勢
Reducing packing material: Max 30 percentage. Improving storage space: Max 600 percentage, conventional ratio of Fujitsu. Reducing packaging time: Max 50 percentage, conventional ratio of Fujitsu
商品和服務
Transportation > Vehicles other than rail vehicles
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