Search
  • 网站搜寻
亚洲知识产权资讯网为知识产权业界提供一个一站式网上交易平台,协助业界发掘知识产权贸易商机,并与环球知识产权业界建立联系。无论你是知识产权拥有者正在出售您的知识产权,或是制造商需要购买技术以提高操作效能,又或是知识产权配套服务供应商,你将会从本网站发掘到有用的知识产权贸易资讯。
返回搜索结果

Thermally Re-mendable Cross-linked Polymers


技术优势

Can endure multiple cycles of crack mending and structural function recovery. The self-mending properties would allow for a longer lifetime than other polymeric materials of similar strength Facile fabrication and repair procedures. For repair to be successful, does not require additional ingredients such as a catalyst, additional monomer, or a special surface treatment of the fractured surface. Hard, tough, and stable at ambient temperatures. Most of these solid polymers are transparent.


技术应用

May be used in various engineering applications. Repairs visible cracks and strengthens the material after a period of use in order to prevent or delay structural failure.


详细技术说明

Researchers at UCLA have identified and reduced to practice a method of making thermally re-mendable polymers. These transparent and colorless polymeric solids, which are composed of two components assembled by the well-known Diels-Alder reaction, can be fabricated without the use of solvent and cured at temperatures ranging from 80 C to 120 C. Once a crack is propagated in this cured material, the crack can readily be thermally repaired. Upon heating the polymeric body to 120 C, many bonds within the material break. Upon slow cooling back to room temperature, these bonds reform in a way that allows for the repair of the fracture. This procedure can successfully be repeated multiple times on the same sample.


附加资料

Patent Number: US6933361B2
Application Number: US2002194332A
Inventor: Wudl, Fred | Chen, Xiangxu
Priority Date: 12 Jul 2002
Priority Number: US6933361B2
Application Date: 12 Jul 2002
Publication Date: 23 Aug 2005
IPC Current: C08F000260
US Class: 528365 | 528363 | 528392 | 528393
Assignee Applicant: The Regents of the University of California
Title: Thermally re-mendable cross-linked polymers
Usefulness: Thermally re-mendable cross-linked polymers
Summary: For making polymeric materials (claimed) for composites, foamed structures, structural adhesives, or insulators for electronic packaging.
Novelty: Making of polymeric material for e.g. composites or foamed structures, involves mixing maleimide moieties and furan monomers that are capable of forming thermally reversible covalent bonds with maleimide moieties


主要类别

化工/材料


细分类别

化工/材料应用


申请号码

6933361


其他

State of Development

This invention has been fully implemented, taken from concept to design to practice. Mechanical properties of the material have been tested under a variety of conditions.


Background

Highly cross-linked polymers have been studied for a number of engineering applications for uses such as adhesives, insulators, and electronic packaging. However, highly cross-linked polymers are also known to be brittle and susceptible to cracking. Therefore, self-mending highly cross-linked polymers hold great promise for overcoming this challenge. These polymers could also find use in automobiles, self-healing windows, and the protection of silicon chips. Several methods have been demonstrated for the creation of self-healing materials. For example, thermoplastics can be repaired by thermally melting the damaged material back together. Materials have also been fabricated that have embedded hollow fibers or capsules within the material itself, so that when a crack propagates, small molecules with the capability to repair the crack are released. However, the ability of these types of materials to self-heal multiple times is limited.


Related Materials

New thermally remendable highly cross-linked polymeric materials. Chen, X.; Wudl, F.; Mal, A.K.; Shen, H.; Nutt, S.R. Macromolecules 2003, 36, 1802-1807.A thermally re-mendable cross-linked polymeric material. Chen, X.; Dam, M.A.; Ono, K.; Mal, A.; Shen, H.; Nutt, S.R.; Sheran, K.; Wudl, F. Science 2002, 295, 1698-1702. [more]


Additional Technologies by these Inventors


Tech ID/UC Case

20522/2002-343-0


Related Cases

2002-343-0


国家/地区

美国

欲了解更多信息,请点击 这里
Business of IP Asia Forum
桌面版