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Thin Film Deposition System: Simultaneous Physical and Chemical Vapor Deposition
技术优势
Simultaneous physical and chemical vapor deposition
技术应用
Thin film deposition systems
详细技术说明
A UCSC researcher has designed various architectures for a system by which physical and chemical vapor deposition are performed simultaneously or sequentially. This disruptive design will have a significate impact on thin film research communities, which will significantly benefit by this new system. Industry could potentially scale up this invention to design a system not currently commercially available.
申请号码
20180002810
其他
Additional Technologies by these Inventors Tech ID/UC Case 25617/2015-378-0 Related Cases 2015-378-0
国家/地区
美国
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