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Self-Assembling 2D and 3D Nanostructures for Nano-Photonic and Nano-Electronic IC's and Devices


技术应用

This invention will enable the creation of high-quality linear photonic transfer and electronic transfer structures for use in nano-photonic and nano-electronic IC's and devices.


详细技术说明

Researchers at UC San Diego's bioengineering department have developed a bottom-up nano-fabrication process using E-fields and arrangements of nano-pore structures to control the self assembly of higher order structures from functionalized DNA, RNA, oligonucleotides, polypepetides, and other self-assembling molecules. Additionally, two and three dimensional structures and devices may be further realized from these first building blocks. The approach of this invention overcomes the traditional problem encountered with classical synthetic chemistry techniques by preventing the inter/intra molecular linking that inhibits formation of linear DNA structures. By preventing this linking, higher order structures may be realized from multiple functionalized self-assembling components.


附加资料

Patent Number: US8202689B2
Application Number: US2007914122A
Inventor: Heller, Michael | Sullivan, Benjamin | Dehlinger, Dietrich
Priority Date: 11 May 2005
Priority Number: US8202689B2
Application Date: 2 Jun 2008
Publication Date: 19 Jun 2012
IPC Current: C12Q000168
US Class: 4350061
Assignee Applicant: The Regents of the University of California
Title: Nanofabrication processes and devices for the controlled assembly of functionalized nanostructures
Usefulness: Nanofabrication processes and devices for the controlled assembly of functionalized nanostructures
Summary: For controlled fabrication of functionalized nanostructures (claimed).
Novelty: Controlled fabrication system for functionalized nanostructures, has first chamber with solution of polymers, nanopore structure, second chamber, and driving force source for facilitating movement of polymers


主要类别

生物医学


细分类别

DNA /基因工程


申请号码

8202689


其他

State Of Development

Patent pending, licensing rights available.


Additional Technologies by these Inventors


Tech ID/UC Case

19594/2005-133-0


Related Cases

2005-133-0


国家/地区

美国

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