Anisotropic Thermal Conductivity in Carbon Nanotube Reinforced Ceramic Nanocomposites
The improved thermal, electrical and mechanical properties of this composite are:Anisotropic thermal conductivity of a ratio of 3:1 in the aligned plane Electrical conductivity 13 orders of magnitude higher than that of pure alumina (near the metallic conduction threshold) Fracture toughness three times that of pure alumina
Commercial applications for this material include: Ruggedized circuitry substrates Electrically conductive components Advanced ceramics for aerospace and defense High temperature severe load conditions Cutting tools and wear components
A ceramic composite material with improved thermal, electrical and mechanical properties has been developed by researchers at the University of California, Davis through the incorporation of carbon nanotubes into a ceramic matrix. Using novel powder preparation and consolidation techniques, single wall carbon nanotubes (SWCN) and nanopowders of alumina are combined into a composite with remarkable properties. Images Carbon nanotube ceramic nanocomposite
Patent Number: US6976532B2
Application Number: US2003606941A
Inventor: Zhan, Guodong | Kuntz, Joshua D. | Mukherjee, Amiya K.
Priority Date: 26 Jun 2003
Priority Number: US6976532B2
Application Date: 26 Jun 2003
Publication Date: 20 Dec 2005
IPC Current: C04B0035053 | C04B0035117 | C04B003512 | C04B0035443 | C04B003546 | C04B0035488 | C04B003550 | C04B003564 | C09K000514
US Class: 165185 | 1650803 | 165905 | 977833
Assignee Applicant: The Regents of the University of California
Title: Anisotropic thermal applications of composites of ceramics and carbon nanotubes
Usefulness: Anisotropic thermal applications of composites of ceramics and carbon nanotubes
Summary: Used in a microelectronic device, semiconductor package, printed circuit board, microwave device, consumer product, medical device, battery, solid oxide fuel cell, chemical sensor and equipment that is utilized in aerospace and defense industries.
Novelty: Anisotropic thermal barrier for e.g. microelectronic device, has interposing between exothermic device and heat sink surface of heat-spreading layer of composite that comprises carbon nanotubes dispersed in ceramic material matrix
化工/材料
燃料电池
7481267
Related Technologies Additional Technologies by these Inventors Tech ID/UC Case 11337/2003-465-0 Related Cases 2003-465-0
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