Single Solder Ball Impact Tester單焊錫球衝擊儀
- Summary
- With the development of ball grid array (BGA), the strength of BGA becomes important. High speed single solder ball test is one effective method to test BGA strength. This design provides one machine to test single sold ball strength at high speed. The advantage of this design is multi-solder balls can be tested during the impact. And it will provide accurate position and impact speed. This machine uses one motor to provide the impact energy. And in order to acquire stable impact speed, one clutch is used and accelerates one part of clutch first, and when the motor speed increases to an expect speed, the clutch will turn on and the swing bar will suddenly increase to a high speed. The impact speed can be adjusted by motor and clutch control. Based on the experiment results, this machine can well test the single solder ball strength.
- Technology Benefits
- 1. That machine can provide stable impact speed to a single solder ball
2. The machine can test multi-balls in one lines
3. The equipment expenditure is low
4. Easy to use
- Technology Application
- - For use in all kinds of electronic packaging, including package design
- Supplementary Information
- Patent Number: US7810374B2
Application Number: US2008314021A
Inventor: Zhang, Zheming | Wu, Jingshen
Priority Date: 3 Dec 2007
Priority Number: US7810374B2
Application Date: 2 Dec 2008
Publication Date: 12 Oct 2010
IPC Current: G01M000700
US Class: 07301209 | 073841
Assignee Applicant: The Hong Kong University of Science & Technology
Title: Single solder ball impact tester
Usefulness: Single solder ball impact tester
Novelty: Test apparatus for solder joint in portable electronic device, has piezoelectric force sensor to produce electrical output to measure impact force applied by impact tip
- Industry
- Robot/Machinery
- Application Date
- 2 Dec 2008
- Application No.
- US 12/314021
- Patent Information
- US 7810374
- ID No.
- TTC.PA.361
- Country/Region
- Hong Kong
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