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A Distance-Immune Low-Power Inductively-Coupled Bidirectional Data Link

技術優勢
Alleviates modulation index change with coils distance variation Variations in patient movement and surgical placements do not disrupt data monitoring in biomedical implants
技術應用
Biomedical Telemetry  Radio-Frequency Identification  Near Field Communication  Internet of Things
詳細技術說明
UCLA researchers have developed a distance-immune bi-directional half-duplex wireless data link for monitoring data in biomedical implants. By employing a novel approach based on a free-running oscillator tuned by coupled resonators, immunity to distance variation (within limits) is achieved while meeting all other requirements. This invention alleviates the modulation index change with coils distance variation. Therefore, variations in patient movement and surgical placements will not disrupt data monitoring in biomedical implants.
*Abstract
UCLA researchers in the Department of Electrical Engineering have developed a distance-immune wireless data link for monitoring data in biomedical implants.
*Principal Investigation

Name: Asad Abidi

Department:


Name: Dejan Markovic

Department:


Name: Alireza Yousefi

Department:

其他

Background

Wireless power transfer and data communication in biomedical implants is a new method for continuously monitoring brain/body activities. The biomedical implant relays data to a unit outside the human body (uplink direction) and can receive commands or control information in the reverse direction (downlink direction). The data link should be bidirectional, consume very low power inside the body, have enough bandwidth to transfer recorded data from multiple channels and be insensitive to the distance between the external unit and implant. Although the latter feature has been overlooked, distance is highly prone to change due to patient movements and different surgical placements.


Related Materials

Yousefi, A., Yang, D., Abidi, A.A., and Markovic, D., A distance-immune low-power 4-Mbps inductively-coupled bidirectional data link, 2017 Symposium on VLSI Circuits, 2017.


Additional Technologies by these Inventors


Tech ID/UC Case

29410/2017-776-0


Related Cases

2017-776-0

國家/地區
美國

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