亞洲知識產權資訊網為知識產權業界提供一個一站式網上交易平台，協助業界發掘知識產權貿易商機，並與環球知識產權業界建立聯繫。無論你是知識產權擁有者正在出售您的知識產權，或是製造商需要購買技術以提高操作效能，又或是知識產權配套服務供應商，你將會從本網站發掘到有用的知識產權貿易資訊。

返回搜索結果

Microneedles Formed Vertically Within A Semiconductor Substrate

技術優勢: Needles may be formed with various slopes and tip shapes for specific applicationsNeedle arrays may be fabricatedProduces low cost and highly reproducible structures

技術應用: Transdermal drug deliveryInjection or extraction of gases, fluids or suspensionsNeedle arrays may be used to pattern a structureInterface with instrumentation

*Abstract: Traditionally, needles for biomedical applications have been fabricated from stainless steel. Recently techniques have been developed for forming needles from semiconductor materials, usually in the horizontal plane of a semiconductor substrate. Researchers at the University of California, Berkeley have developed an improved needle fabrication method, whereby needles are formed vertically in a semiconductor substrate.

Using standard microfabrication techniques, needles may be formed with various vertical slopes and the needle tips may be formed in a variety of shapes. For example, a combination of isotropic and anisotropic etching is used to produce needles with steep vertical walls, while istropic etching alone is used to produce needles wth sloping vertical walls that terminate in wide bases to withstand relatively large lateral forces. Needles of various lengths and diameters may be formed; representative dimensions are 200 microns in length and 25 microns in diameter.

Regents' patent rights in the vertically-formed needles includes the method of forming the needles and the needles formed thereby.

*Principal Investigation: Name: Dorian Liepmann
Department:

Name: Boris Stoeber
Department:

附加資料: Patent Number: US6406638B1
Application Number: US2000478913A
Inventor: Stoeber, Boris | Liepmann, Dorian
Priority Date: 6 Jan 2000
Priority Number: US6406638B1
Application Date: 6 Jan 2000
Publication Date: 18 Jun 2002
IPC Current: B81C000100 | A61M0005158 | A61M000532 | A61M003700 | B81B000100 | H01L002166
US Class: 216011 | 216002 | 216049 | 216079 | 438712 | 438713 | 438719
Assignee Applicant: The Regents of the University of California
Title: Method of forming vertical, hollow needles within a semiconductor substrate, and needles formed thereby
Usefulness: Method of forming vertical, hollow needles within a semiconductor substrate, and needles formed thereby
Summary: The method is used for forming a needle which is used for biomedical applications used to inject gases, fluids, suspensions and for extracting gases, and liquid and also employed in instrumentation and for guiding electromagnetic waves.
Novelty: Needle fabrication for biomedical application, comprises forming a channel and vertical axial surface in back and front sides of a substrate by anisotropic and isotropic etching, respectively

欲了解更多信息，請點擊這裡