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Electrical signal and power source integration method for diverse 3D multi-chip stacks

總結

Kenneth Shepard, Ph.D.

技術優勢

Allows greater flexibility in the design and production of complex electronics.Reduces cost and complexity of multifaceted chip design Enables greater miniaturization, better noise and signal isolationDelivers more efficient power and signal transfer.Improves overall performance of stack by pairing analog components with digital processors.Confers flexibility for placement of control circuitry in stack.Patent information:Patent Pending

技術應用

Integrates chips used for micro- and nano-electromechanical systemsEnables laser drivers to cooperate with opto-electronics and photonic devices for single-photon sources, semiconductor laser diodes, or vertical cavity surface-emitting lasers.Separates analog and digital circuitry prevalent in everyday devices, i.e. cell phones and laptop computers.Expands to applications involving integrated voltage regulators, analog high-speed serial links, clock synthesis, and other types of voltage and power control models.

詳細技術說明

Kenneth Shepard, Ph.D.

*Abstract

None

*Inquiry

Jay HickeyColumbia Technology VenturesTel: (212) 854-8444Email: TechTransfer@columbia.edu

*IR

CU12054

*Principal Investigation

*Publications

N. Sturcken, M. Petracca, S. Warren, L. P. Carloni, A. V. Peterchev and K. L. Shepard. An integrated four-phase buck converter delivering 1A/mm2 with 700ps controller delay and network-on-chip load in 45-nm SOI. Custom Integrated Circuits Conference (CICC), September, 2011, pp. 1-4. Further Information: Columbia | Technology VenturesJay Hickey; Tel: (212) 854-6521Email: TechTransfer@columbia.edu

國家/地區

美國