High-Resolution Vertical Scanning Interferometry
- 詳細技術說明
- A fast, robust method of surface topographic analysis.
- *Abstract
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Technology
Vertical Scanning Interferometry (VSI) is a non-destructive technique used to quantify the topography of solid surfaces that reflect light. Currently, the vertical resolution of commercially available VSI systems is in the (sub)angstrom to nanometer scale, depending on the data acquisition method used. The lateral resolution is defined by the wavelength of the light source, and the aperture of the MIRAU-objective lens, typically about 500 nanometers in the case of a 50x lens objective. For a large number of applications, e.g. the study of microorganisms, tissue cells, and some processes occurring at fluid-solid interfaces, the existing lateral resolution of conventional VSI methods is insufficient.
Advantages
Recently, Rice researchers have pioneered High-Resolution VSI (HiRes-VSI), which improves the lateral resolution of VSI significantly. This important breakthrough was achieved through a combination of software and hardware innovations. HiRes-VSI builds on existing VSI technology, and incorporates nano-precision, sample positioning technology with the application of image processing algorithms to achieve super resolution.
First, a number of images are obtained with the actual resolution of the conventional technique. These images have each, and offset fraction of a pixel. The images are superimposed into a single, blurred image, but which contains more information than any of the low-resolution images. Then, digital image restoration is used to deblur the high-resolution image to obtain the best possible result.
HiRes-VSI incorporates a large field of view, high vertical and lateral resolution, and fast data acquisition making it a powerful complementary technique to Atomic Force Microscopy (AFM). HiRes-VSI is capable of scanning large, vertical differences in surface topology, currently up to 100 microns. HiRes-VSI also has a large field of view, up to 156 x 164 microns by using a 50x objective or even to 840 x 760 microns by using a 10x objective. In addition, data acquisition is very fast, i.e., on the order of seconds to minutes.
Applications
The areas of possible application for a non-destructive method that is capable of quantifying both surface topography and the processes that change the surface are numerous. A few example of current applications span from mineral, glass and metal corrosion, to crystallization/growth rates, to microbial interactions with substrates, to the behavior of tissue cells in certain environments or quality control of production processes of small high-quality structures, e.g., micro chips.
The University is seeking partnerships to help develop commercial applications for this invention.
A utility patent (7,324,215) has been issued by the USPTO.Inquiries
Nila Bhakuni
713-348-6231
bhakuni@rice.edu
- 國家/地區
- 美國
