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Thermal and/or Electrical Contact Conduction Enhancer

總結
Researchers at Purdue University have developed a product that provides greater conduction at the interface of two surfaces than other removable products. The technology affords this advantage by creating increased contact area at the interface through billions of surface contact sites, and in effect, reduces the thermal and electrical resistance between the two surfaces. This product is versatile enough to be used alone or with existing commercial greases and wax-based PCMs.
技術優勢
Provides lower thermal and electrical resistance than any other removable interface materialEasily conforms to a variety of surfacesIncreased area of contact between surfacesProvides application to many processes in electronics industry
技術應用
Electronics Industry
詳細技術說明
Timothy FisherNanoscale Transport Research GroupPurdue Mechanical Engineering
*Abstract

*Background
In the electronics industry, a common issue is the transfer of heat away from heat producing components and the surrounding components. Continuous contact between the components is not physically possible resulting in an air gap, which is a very poor conductor. Current methods to compensate for these gaps include thermal greases and phase change materials (PCMs), which have efficiency limitations.
*IP Issue Date
Jul 17, 2012
*IP Type
Utility
*Stage of Development
Prototype Testing
*Web Links
Purdue Office of Technology CommercializationPurdueInnovation and EntrepreneurshipTimothy FisherPurdue Mechanical Engineering
國家
United States
申請號碼
8,220,530
國家/地區
美國

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