亞洲知識產權資訊網為知識產權業界提供一個一站式網上交易平台，協助業界發掘知識產權貿易商機，並與環球知識產權業界建立聯繫。無論你是知識產權擁有者正在出售您的知識產權，或是製造商需要購買技術以提高操作效能，又或是知識產權配套服務供應商，你將會從本網站發掘到有用的知識產權貿易資訊。

返回搜索結果

ELECTRONIC DEVICES IN PLASTIC

總結: The invention concerns methods for forming an electronic device in plastic. In another aspect, the invention concerns an electronic device formed according to the method.

技術優勢: Enables the production of electronic components to be housed in unique situations required by Industry.

詳細技術說明: The invention concerns a method for forming an electronic device in plastic. The method for forming an electronic device in plastic comprises: (a) placing electronic components in recesses in a thermoplastic substrate; (b) depositing an electronic circuit over the electronic components or onto a thermoplastic sheet; and (c) bonding the thermoplastic substrate with the thermoplastic sheet in a thermal bonding process to seal the electronic components and the electronic circuit between the thermoplastic substrate and the thermoplastic sheet wherein the method further comprises providing a thermally conductive layer on the thermoplastic sheet and/or substrate such that heat applied during the thermal bonding process is distributed uniformly across the thermoplastic sheet and/or substrate to facilitate bonding of the thermoplastic sheet and substrate. In another aspect, the invention concerns an electronic device formed according to the method. It is an advantage that a more uniform heat distribution is achieved.

欲了解更多信息，請點擊這裡