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A method and system for bonding electrical devices using an electrically conductive adhesive

總結

A system for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together, the system comprising: an ultrasonic transducer to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus operatively attached to and covering an operational end of the ultrasonic transducer, the ultrasonic to thermal energy apparatus damping the ultrasonic vibration to minimize ultrasonic vibration transmitted to a first electrical device and causing the conversion of the ultrasonic vibration to a heating pulse which is conducted through the first electrical device to the adhesive; wherein the adhesive is softened by the heating pulse to bond the electrical devices together.

附加資料

Patent Number: CN101996905B
Application Number: CN201010262578A
Inventor: KE, Shao-rong
Priority Date: 24 Aug 2009
Priority Number: CN101996905B
Application Date: 24 Aug 2010
Publication Date: 6 Mar 2013
IPC Current: H01L002160
Assignee Applicant: The Hong Kong University of Science & Technology
Title: Method and system for bonding electrical devices using an electrically conductive adhesive
Usefulness: Method and system for bonding electrical devices using an electrically conductive adhesive
Summary: The method is used for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together.
Novelty: Bonding electrical devices using electrically conductive adhesive comprises generating ultrasonic vibration, damping the ultrasonic vibration to minimize ultrasonic vibration, and softening the adhesive using a heating pulse

主要類別

生物醫學

細分類別

醫療裝置

其他

OR Siu-wing, Derek

國家/地區

美國