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Method For Measuring Elastic Properties

總結: This Invention Relates To A Method For Measuring Elastic Modulus Of A Sample Object. This Invention Also Relates To A Method For Correcting Creep Effects In The Modulus Measurement. The Error Due To Creep In The Apparent Contact Compliance Is Equal To The Ratio Of The Indenter Displacement Rate At The End Of The Load Hold To The Unloading Rate. Determination Of This Error Term And Deduction Of It From The Measured Contact Compliance Can Be Easily Done At A Low Cost By Modifying The Data Analysis Software In Any Commercial Depth-Sensing Indentation System.

附加資料: Patent Number: US20050066702A1
Application Number: US2004917391A
Inventor: Feng, Gang | Ngan, Alfonso, Hing Wan
Priority Date: 20 Nov 2001
Priority Number: US20050066702A1
Application Date: 13 Aug 2004
Publication Date: 31 Mar 2005
IPC Current: G01N000342 | G01N000302
US Class: 7300101
Title: Method for measuring elastic properties
Usefulness: Method for measuring elastic properties
Summary: For measuring elastic property e.g. elastic modulus of sample material such as crystal material, second-phase particles in matrix, thin-films deposited on substrates, using depth-sensing indentation system.
Novelty: Measurement method of elastic property e.g. of crystal material, involves obtaining correction term to determine elastic property of sample material

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