亚洲知识产权资讯网为知识产权业界提供一个一站式网上交易平台,协助业界发掘知识产权贸易商机,并与环球知识产权业界建立联系。无论你是知识产权拥有者正在出售您的知识产权,或是制造商需要购买技术以提高操作效能,又或是知识产权配套服务供应商,你将会从本网站发掘到有用的知识产权贸易资讯。

Inorganically Surface Modified Polymers for Orthopaedic and Spinal Implants

详细技术说明
University researchers have developed surface-nanopatterned polymers for implant applications, in particular, PEEK materials modified to exhibit nanostructured surfaces that promote osseointegration. Surface modification is done by coating the polymer with biocompatible metals, alloys, and oxides that are nanostructured by various means. Whereas polymers integrate poorly with bone, the invention’s nanostructured coating enhances cell adhesion and promotes preferential stem cell differentiation to bone cells. The invention thus enables use of elastically bone-like and x-ray translucent PEEK for knee prostheses and other joint replacements or bone-anchored implants, e.g., hip and shoulder replacements and dental implants.
*Abstract
PolyEther EtherKetone (PEEK) is increasingly being used in spinal implants and investigated as a biomaterial for orthopedic implants because of its mechanical toughness, resistance to thermal and chemical degradation, and non-toxicity. Its main advantages over titanium are its x-ray translucence and elastic modulus similar to that of bone. PEEK can be easily viewed with radiography and magnetic resonance to assess implant positioning and stability. It reduces stress shielding in bone and bone resorption, which are common problems from implanted metals with mismatched elasticity properties. PEEK is only now beginning to be explored as a material for joint replacements. It has been shown as an excellent material for articulation in the joint; however, it does not interface well with bone. There is a need for chemically or micro/nanostructurally modified PEEK surfaces that adhere strongly to the PEEK substrate and bond well with bone.
*IP Issue Date
Apr 14, 2015
*Principal Investigation

Name: Chulmin(Edward) Choi

Department:


Name: Sungho Jin

Department:


Name: Garrett Smith

Department:

申请号码
9005648
其他

Intellectual Property Info

The technology has a patent pending and is available for licensing and/or sponsorship.


Tech ID/UC Case

21954/2010-337-0


Related Cases

2010-337-0

国家/地区
美国

欲了解更多信息,请点击 这里
移动设备