Tacky Dot® Technologies
- 技术应用
- These methods are widely applicable and are available for many fields of use.
- 详细技术说明
- As part of the Tacky Dot® donation, the University is offering for commercialization technologies related to improved photo-imageable solder delivery allowing for 3-5 micron diameter solder balls, cleanup of excess particles from an array of Tacky Dots®, materials useful for precise delivery of arrays of particles to substrates, and a new method for reducing tribo-charging that results when solder spheres contact a coated film.
- *Abstract
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None
- *Principal Investigation
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Name: Ronald Convers
Department:
Name: Ralph Nelson
Department:
- 其他
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Related Materials
Tech ID/UC Case
21042/2002-092-0
Related Cases
2002-092-0, 2002-823-1, 2002-824-1
- 国家/地区
- 美国
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