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Microfluidic Component Package

技术优势

Improves consistency and ease of integrating electrical, optical, mechanical, and thermal connections within a microfluidic component package (MFCP) capable of being readily integrated within a larger microfluidic system in a manner that is compatible with large-scale manufacturing and, in most cases, reduces cost.

技术应用

The present invention is applicable in medical or healthcare industries where an assay is to be performed on a small liquid sample such as blood or saliva.

详细技术说明

Microfluidic systems are used for applications where small quantities of fluid need to be manipulated and controlled. A microfluidic component consists of a small device that is intended to be embedded within a microfluidic system. It typically contains one or more ports that allow the components to come in contact with fluid that is routed on a microfluidic layer, and perform a function that is useful to the operation of the microfluidic system. Microfluidic components may perform operations such as micro-pumps, micro-valves, micro-heaters, micro-electrodes, micro-sensors, etc. A microfluidic component package (MFCP) allows a device to be readily integrated with the microfluidic system. Conventional microfluidic production approaches produce capillary systems in polymer, glass or other materials using embossing or etch methods. These methods are efficient at producing microfluidic channels, but they are poor for integrating electronics, optics, and mechanical functions into the same system. Usually, these non-fluidic are added as external components after the microfluidics has been produced. In some cases, attempts are made to include these functions during the manufacturing process of the microfluidic channels; however, this results in highly complex and expensive manufacturing processes that are not suitable for large scale production. To embed the components within the larger microfluidic system, the components need to be connected to one or more microfluidic channels, and may require other connections such as electrical, optical, mechanical, or thermal connections. Currently, there is no way to do this in a consistent manner that is compatible with large-scale manufacturing. The present invention discloses a Microfluidic Component Package (MFCP) that can produce a consistent interface between a small microfluidic device and a larger microfluidic system, while also allowing access to electrical, optical, mechanical, and thermal connections.

*Abstract

The present invention describes a component package that enables a microfluidic device to be fixed to a Printed Circuit Board (PCB) or other substrate, and embedded within a larger microfluidic system.

*Principal Investigation

Name: Sarkis Babikian

Department:

Name: Mark Bachman

Department:

Name: Guann Pyng Li

Department:

其他

Limitations

Once the electrical, optical, mechanical, or thermal connections are embedded the MFCP, they cannot be changed.

Tech ID/UC Case

27438/2016-768-0

Related Cases

2016-768-0

国家/地区

美国