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Enhancement of laser oxide removal processes for plating (LORP) simplifies one-step plating of oxide-coated materials

总结

Laser oxide removal for plating (LORP) is a plating preparation system that uses laser irradiation to remove the native oxide film from the substrate immersed in an electrolyte solution. While LORP reduces the pre-processing required to plate metals and allows for simultaneous plating and oxide removal, it also suffers from drawbacks such as high cost and time consumption as well as the use of environmentally harmful chemicals. This technology presents several improvements over previously developed LORP techniques that serve to reduce cost and minimize optical attenuation, thus increasing the efficiency of the system. These improvements include the use of a thin electrolyte layer and the removal of the electrolytic cell window through which the laser beam passes. The improved LORP system functions by wetting a porous material in contact with the substrate to cause immersion plating. The substrate is then passed into a second tank for plate-up via electroplating.

技术优势

Eliminates the need for time-consuming and environmentally hazardous pre-processing stepsReduces electrolyte wasteImproves adhesion of plated layer Minimizes optical attenuation to improve laser efficiencyMaximizes process design flexibility because processes can take place in or out of the plating electrolyte May be used for reel-to-reel platingPatent Information:Patent Pending (US20110104396)Tech Ventures Reference: IR M10-023

技术应用

Plating for RF applicationsPlating to enable soldering and bondingCorrosion inhibition for the manufacturing of computers, mobile phones, electronic devicesCoating for wear, chemical resistance, and low friction interfaces for automotive, aerospace and petrochemical fieldsCoating of microelectrode arrays, pin grid arrays, semiconductor wafers, and medical devices such as catheters, pacemaker leads, titanium coated rods and screwsMaskless pattern definitionSurface modification of steel and other metals for corrosion resistanceMEMS multilayer fabricationGold/silver/platinum plating for low cost jewelry and artActivated surfaces for chemical reactions, such as carbon nanotube growthThermal interfaces using copper thin films for enhanced heat transfer between metal cooling components for semiconductor chips

详细技术说明

None

*Abstract

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*Inquiry

Jim AloiseColumbia Technology VenturesTel: (212) 854-8444Email: TechTransfer@columbia.edu

*IR

M10-023

*Principal Investigation

*Publications

von Gutfeld RJ, Gallway JW, West AC. “In Situ Immersion Plating of Copper and Nickle on Aluminum Using Laser Pulses for Oxide Removal.” J Electrochem Soc 2009;156(2):D564-D569.

国家/地区

美国