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Stress analysis using a defect-free four-node finite element technique

总结

Lead Inventors: Gautam Dasgupta, Ph.D.Problem or Unmet Need:The analytical solution of equilibrium and constitutive equations for structural analysis and design is rendered difficult for real-world problems with complex geometries. While finite-element methods, overcome this difficulty by tiling or tessellating the region of interest, this approximation can lead to errors.The tiling of a two-dimensional surface by triangulation tends to incur unacceptably large errors for bending. While the use of quadrilaterals as elements can reduce this error, quadrilaterals in turn introduce an approximation due to artificial "stiffening", or additional zero-energy modes other than rigid-body responses.In the interest of computational accuracy and efficient design, new "defect-free" elements are needed which are free of such modeling errors.This invention introduces a computer method for determining stress, strain, and/or deformation of a two-dimensional solid by algebraically generating a "defect-free" nodal force-displacement relationship. This invention relates to solid-body stress analysis and more specifically to the analysis of uniform stress due to compression, stretching, shearing, and/or pure bending individually or in combination, of a two-dimensional solid of uniform thickness.

技术优势

Greater modeling accuracy compared to existing two-dimensional finite elements Accurate analysis and design leading to material savings during manufacturing

技术应用

In the manufacturing and design of load bearing structures such as buildings, bridges, dams, automobiles, ships, and aircraft In bioengineering applications for the analysis and design of hard and soft tissue

详细技术说明

This invention introduces a computer method for determining stress, strain, and/or deformation of a two-dimensional solid by algebraically generating a "defect-free" nodal force-displacement relationship. This invention relates to solid-body st...

*Abstract

None

*Inquiry

Jim Aloise Columbia Technology Ventures Tel: (212) 854-8444 Email: TechTransfer@columbia.edu

*IR

MS96/05/15

*Principal Investigation

*Web Links

USPTO issued patent: 6,101,450

国家/地区

美国