A fingerprint image acquisition device includes: a light source, a finger touching surface, a convex lens, an image sensor and a grating. The light source is a surface light source, and the grating is disposed on a light output surface of the light source. The light source is configured to emit a li.....
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The invention relates to a composite substrate for light emitting device and a LED module equipped with the composite substrate for light emitting device. The composite substrate for light emitting device includes a metal substrate, an insulating carrier and an electrode, the metal substrate and the.....
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本發明涉及LED燈具及其所採用的光學透鏡。所述LED燈具包括LED光源和覆蓋LED光源的光學透鏡。其中，光學透鏡包括圓頂結構和凸出結構，圓頂結構具有一外表面，凸出結構突設於圓頂結構的外表面且包括相對設置的第一側面和第二側面。第一側面具有一第一光學面和一第二光學面，第二側面具有一第三光學面，第二光學面與所述外表面直接相接且連接在圓頂結構的所述外表面和第一光學面之間，第二光學面和第一光學面的交界線不位於所述圓頂結構的所述外表面，第三光學面與圓頂結構的所述外表面直接相接。
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一種電子裝置包括一第一機體、一第二機體和一鎖固結構。第二機體包括一對應卡固部。鎖固結構設於第一機體，其包括一轉軸、一卡固結構、一止擋件、一彈力件和一控制件。轉軸設於第一機體，其包括一推抵部。卡固結構可移動得連接轉軸，卡固結構包括一卡固部，卡固部用以卡固對應卡固部。止擋件連接轉軸。彈力件連接轉軸並設於卡固結構和止擋件之間。控制件連接轉軸或止擋件，用以使推抵部推抵卡固結構。
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The present disclosure provides a LED package structure and a LED light-emitting device. The LED package structure comprises a LED chip and a wavelength converting layer covering the LED chip. The wavelength converting layer contains red phosphor, which has lower amount in edge portion than in cente.....
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