Methods and systems are provided to utilize and manufacture a stacked chip assembly. Microelectronic or optoelectronic chips of any dimensions are directly stacked onto each other. The chips can be of substantially identical sizes. To enable forming the stacked chip assembly, trenches are laser micr.....
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Briefly, embodiments of methods or structures for reconstruction of uniform digital signal sample values from nonuniform digital signal sample values are disclosed.
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The prosthesis device can have a pair of articular members adapted to be mounted onto adjoining bones, respectively, to replace a joint. The first and second articular members can have first and second bearing elements, respectively. The bearing elements can be formed to be capable of replacing at l.....
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An AC to AC power conversion apparatus with constant power feeding characteristics to fluorescent lamp or HID lamp is described. The constant power characteristic is achieved by discontinuous mode operation of capacitor coupled in series with the load. Packets of energy are pumped out to the load in.....
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