The device/method:ΓÇóEnables quantification of potential mechanical deformationsΓÇóSignificantly minimizes pre-cooling effects as observed with conventional techniquesΓÇóAccurately measures the distance travelled by a sample before contacting the mirror surfaceΓÇóSignificantly improves the quality a.....
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Michael M. Shen, Ph.D.
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Extended depth of field for thick/non-sectioned samples Short computing time High resolution images Compatible with standard microscopes
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This invention provides processing steps, methods and materials strategies for making patterns of structures for electronic, optical and optoelectronic devices.
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