Preserves performance of ULLWs (< 0.1 dB/m) and active silicon layersSame tight thickness tolerance of SOI waveguide layerIncreased bandwidth due to tapered couplersDecreased overall costs
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A high-throughput web-based application was developed that helps even non-technical users to process large amounts of next-generation sequencing data.
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The invention relates to a universal ligandthat incorporates metals and bioorganic molecules into a metal-silica-bioorganichybrid.
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·Improved alarm management and enhanced patient safety
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Uniform defect reduction across filmHighly efficient process capable of being done on the nanometer scaleImproved performance of semi-polar and non-polar group-III nitride based devicesHighly adaptable and easily controllable process
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