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The invention provides an input/output port (I/O port) switch structure of an electronic device. The electronic device comprises a motherboard, and an opening is installed on a predetermined position of the electronic device. The switch structure is installed on the motherboard of the electronic dev..... [更多]
A package substrate includes: an insulating substrate, a first and a second soldering pads spacedly disposed on a first surface of the insulating substrate, a first and a second electrodes spacedly disposed on an opposite second surface of the insulting substrate. The first and the second soldering ..... [更多]
The present invention provides an apparatus and method for controlling power and clock speed of an electronic system. The present invention detects a voltage signal and a current signal as the electronic system is operating, and obtains a power value. The present invention decides whether the power ..... [更多]
An integral structure including an antenna and a shielding cover for a wireless product, comprising: a shielding cover for avoiding electromagnetic interferences; an antenna longitudinally spaced from the shielding cover by a distance, and the antenna being approximately parallel to the neighboring ..... [更多]
A motherboard includes a printed circuit board and plural connectors. The connectors, which include sockets and ports, are mounted on the printed circuit board. Each of the connectors has plural conductive terminals. Each conductive terminal has a substrate layer and an electroplating layer formed o..... [更多]
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