ΓÇóContactless processΓÇóHigh-volume assembly of small size, ultra-thin semiconductor bare diesΓÇóThe tmSLADT process can package dies with sizes well below the lower limit of conventional manufacturing technologiesΓÇóPackaging is about 10 times faster compared to that found in conventional methodsΓ.....
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Transposableelements are DNA sequences capable of hopping from one spot in a genome toanother. These DNA elements may be used to introduce foreign DNA sequences intoan organism for applications including genetic engineering, mutant straincreation, and gene mapping. The rice genome is one source of t.....
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This invention provides a drawing process that can be used to fabricate, in an ambient environment, a variety of nanowires with characteristic diameters below 100nm, in lengths of 1mm, 10 mm or even longer, and with properties that are non-porous (solid) and three dimensional.
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