Improves C4 (solder balls) life expectancy by 49X
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The subject invention employs two methods for layout decomposition for double patterning lithography (DPL) based on integer linear programming (ILP) formulations. In an exemplary embodiment of the invention, a pre-processing step fractures polygonal layout features into rectangles according to v.....
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Reduced defect density in semipolar nitride films Can be performed multiple times to further decrease dislocation density
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