The new UC technology provides the following benefits: Produces thin buffers with low costs and high yields; Low-temperature growth process can be integrated into any current type of processing technology that requires lower thermal budgets; Greatly improves the quality of buffers in terms of both t.....
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Any material that can be electroplated on a conductive substrate could be used. The process uses very low volume of plating solution, therefore reducing cost and waste. Deposits a thin film only where needed without mask, photolithography and etch steps. Film thickness and other film properties can .....
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Uses standard CMOS materials and processes, scaleable, low voltage levels, high density, three dimensional fabrication
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Increased external quantum efficiencyLow cost etchingRapid etchingEliminate the need of mechanical etchingPossible automation of the etching process
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Increases speed of communication between microprocessors/microchips, allowing for faster computing. Reduces the area required to communicate, reducing the size of chipsets. Allows for very fast optical communication which increases data transfer bandwidths in chipsets. Smaller than current technolog.....
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