The current invention utilizes wafer-level assembly and packaging, resulting in a very compact unit (less than 1cm²). By utilizing a folded 3D structure, high aspect ratio single-axis sensors are configured along independent sensitive axes. All devices are fabricated with identical techniques that r.....
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A compact 3D electrochemical sensor constructed on a pliant substrate for in-vitro and in-vivo measurements of cells and tissues. The device includes a specially designed sensing layer containing reference and measurement electrodes that are connected to contact pads on the back side of the device b.....
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A compact 3D electrochemical sensor constructed on a pliant substrate for in-vitro and in-vivo measurements of cells and tissues. The device includes a specially designed sensing layer containing reference and measurement electrodes that are connected to contact pads on the back side of the device b.....
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Invention: Filaments made of a thermoreversible thermoset based on Diels Alder cycloadductsare used in 3D filament printing to create 3D artifacts that will irreversibly cure via reaction ofreactive diene or dienophile components. This allows filaments to be made and a thermoset tobe formed in the f.....
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