The current invention utilizes wafer-level assembly and packaging, resulting in a very compact unit (less than 1cm²). By utilizing a folded 3D structure, high aspect ratio single-axis sensors are configured along independent sensitive axes. All devices are fabricated with identical techniques that r.....
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A compact 3D electrochemical sensor constructed on a pliant substrate for in-vitro and in-vivo measurements of cells and tissues. The device includes a specially designed sensing layer containing reference and measurement electrodes that are connected to contact pads on the back side of the device b.....
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