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A system for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together, the system comprising: an ultrasonic transducer to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus operatively attached to and covering an oper.....
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Removed 35% to 96% of small-scale assembly errors. Introduced positional de Bruijn graph for contig refinement. Demonstrated utility in hard (single-cell) assembly. SEQuel can be used in combination with any NGS assembler.
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