Allows for wafer scale integration Places cavities at predetermined locations Simplifies the fabrication method and significantly reduces costs
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Eliminates parasitic resistance/capacitance elements, simplicity of addressing each transistor element, capability to completely remove parasitic burdens to the transistors.
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Description:Frostforms when humid air comes into contact with a surface that is below the dewpoint and freezing temperature of water.Frost formation can have severe negative consequences. Many engineeringsystems such as aeronautics, refrigeration, and wind turbines are hindered byfrost. The ability .....
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