This improved material relates to novel planar materials having band gap properties, and in particular to such materials formed with fractal patterns. Band gap materials are ideal for shielding electromagnetic (EM) radiation as they have a gap in the transmission band thus blocking transmission of E.....
[更多]
Electroplating-based flip chip solder preparation process had been widely used over other preparation methods. Although it is cheaper and is able to achieve the material deposition on the fine pitch I/O pads, the solder bumps resulted are not uniform and not quality-guaranteed. In this invention, ma.....
[更多]
Conventional graphite made from sulfuric acid-graphite intercalation compound (GIC) contains much amount of sulfur, which cause environmental pollution and corrosion.The invention provides a new formic acid-GIC synthesized by an electrochemical process in which formic acid is used as electrolyte. Th.....
[更多]
