微组装技术主要包括电路基板制造和组装封装技术。其中，高密度多层电路基板制造技术主要包括薄膜技术和后膜技术。目前，已成功开发了切片机、生瓷带打孔机、微孔填充机、精密网版印刷机、叠片机、热切机、LTCC 烧结炉等LTCC 工艺线的整套关键设备和部分薄膜多层基板制造、芯片凸点制造等20 余种关键设备。已具备微电子高密度多层基板制造集成工艺基本解决方案的能力和提供LTCC生产线整套关键设备的能力。目前已经处于产业化初期阶段，已经成功建设两条生产线，并成功运行，先后获得中国电子科技集团公司科技进步奖4 项，后的20余项专利授权（其中发明专利11 项）。知识产权状况及获奖情况：1、共晶压力精确调节结构（2.....
[更多]
A regulatable gene expression construct comprising a nucleic acid molecule comprising a two-way riboswitch operably linked to a target sequence. Also provided is a library screening strategy for efficient creation of target-specific riboswitches. A theophylline-repressible and IPTG-inducible riboswi.....
[更多]
The present invention relates to a fixation device for internally fixing fractures. The fixation device has an elongated support plate and a transverse plate and a fin member extending transversely from the elongated support plate. The elongated support plate and the transverse plate define a plural.....
[更多]
