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Methods for Integrated Circuit C4 Ball Placement Considering Package Reliability
Improves C4 (solder balls) life expectancy by 49X [更多]
Tags: Other IC Assembly and Packaging algorithm integrated circuits Thermal semiconductors temperature connectors capacitors inductors flip-chip Expansion I/O solder bumps electromigration C4 balls floorplanning
Methods For Layout Decomposition For Double Patterning Lithography
The subject invention employs two methods for layout decomposition for double patterning lithography (DPL) based on integer linear programming (ILP) formulations. In an exemplary embodiment of the invention, a pre-processing step fractures polygonal layout features into rectangles according to v..... [更多]
Tags: Design and Fabrication
Lateral Growth Method for Defect Reduction of Semipolar Nitride Films
Reduced defect density in semipolar nitride films Can be performed multiple times to further decrease dislocation density [更多]
Tags: Design and Fabrication Engineering All Optics and Photonics cenIEE indssl indbulk nitride films
Silicon Nanowires for Efficient Solar Power Generation
None [更多]
Tags: nanoparticles fabrication Device network semiconductors magnetic and superconductory materials/device electronic circuits components and equipment interpenetrating microengineering nanotechnologies related to electronics and m printed circuits and integrated circuits
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